VECO 最新10-Q变化

相对上期新增的文字 · 来源:10-Q · 2026-08-05

• In logic and foundry, we have long-standing and trusted customer relations and our annealing solutions continue to gain traction at advanced node customers. Our LSA platform is production tool of record at all three Tier 1 logic customers, driving repeat business. Additionally, our next-generation N…

• In the memory market, we continue to expand our presence as there is significant long-term opportunity as AI-driven computing architecture accelerates demand for Dynamic Random Access Memory (“DRAM”) and NAND technologies. These technology transitions are creating new thermal processing and material…

• In Advanced Packaging (“AP”), which includes our wet processing and lithography systems, we continue to experience increased demand as AI-related investments accelerate adoption of heterogenous integration of advanced 2.5D and 3D architectures. In the second quarter, we had an increase in orders for…

• the year, bringing increased visibility through 2027. The sustained interest from leading customers in our ability to enable their extreme ramp and AP roadmap supports our confidence in the outlook for the business.

• Looking ahead, we anticipate growth in the semiconductor market in leading-edge investment driven by AI investments.

相对上期删除的文字 · 来源:10-Q · 2026-05-05

• In the logic market, our annealing solutions continue to gain traction at advanced node customers. Our LSA platform is production tool of record at all three Tier 1 logic customers. Our next-generation Nanosecond Annealing (“NSA”) system is progressing through evaluations at Tier 1 logic customers. …

• In the memory market, we continue to expand our presence as current and future roadmap requirements for Dynamic-Random-Access Memory (“DRAM”) drive the need for low-thermal-budget anneals used in high-band-width memory and vertical DRAM devices. We are the production tool of record at a leading high…

• In Advanced Packaging (“AP”), our wet processing systems are used for several applications, and we continue to see strong demand driven by Heterogenous Integration and 2.5D and 3D Packaging for AI and high-performance computing. In the first quarter, we had an increase in orders for our wet processi…

• Looking ahead, we anticipate growth in the semiconductor market in leading-edge investment driven by AI and high-performance computing.

• Compound Semiconductor revenue increased by 31% in the first quarter from the comparable prior year period, comprising 12% of total revenue. In the Compound Semiconductor market, we have a broad portfolio of products which are gaining momentum due to a significant inflection point within the industr…

相对上期新增的文字 · 来源:10-Q · 2026-08-05

• changes in fair value from these contracts are recorded as “Other, net” in our Consolidated Statements of Operations. We execute derivative transactions with highly rated financial institutions to mitigate counterparty risk.

• Our net sales to customers located outside of the United States represented approximately 69% and 74% of our total net sales for the three and six months ended June 30, 2026, respectively, 87% and 86% for the comparable 2025 period. We expect that net sales to customers outside the United States wil…

相对上期删除的文字 · 来源:10-Q · 2026-05-05

• Our net sales to customers located outside of the United States represented approximately 80% and 86% of our total net sales for the three months ended March 31, 2026 and 2025, respectively. We expect that net sales to customers outside the United States will continue to represent a large percentage…